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Method of Fabricating and Integrating High-Quality Decoupling Capacitors
Technical Challenge:Provide sufficient decoupling capacitance physically close to the processor.
Description:This method can be used to build decoupling capacitors with high capacitance values, low parasitic losses, good yield, and long-term reliability. The fabrication method can also manufacture other passives such as inductors and resistors; as well as interconnect lines. The invention enables high yielding capacitors and other passive elements to be placed very close to the processor or other integrated circuit design and provides improved signal integrity for high frequency processing. Additionally, it allows multiple passive components to be integrated into a single module, reducing cost and increasing yields for RF systems.
Demonstration Capability:None available at this time
Potential Commercial Application(s):Supercomputing applications, high-speed processor systems, hand held electronics (cell phones, pagers, etc.)
Patent Status:Issued: United States Patent Number 7,297,613 (Updated).
Reference Number: 1352
If you are interested in exploring this technology further, please express your interest in writing to the:
National Security Agency
Date Posted: Jan 15, 2009 | Last Modified: Jan 15, 2009 | Last Reviewed: Jan 15 2009