Accredited Suppliers:

  • IBM (Vermont)
    IBM Systems Technology Group offers a comprehensive suite of trusted technology manufacturing and technology services. Foundry options include digital CMOS offerings ranging from 250nm to 65nm, analog and mixed signal/SiGe BiCMOS offerings ranging from 350nm to 130nm, while providing services ranging from basic foundry manufacturing to end-to-end solutions.
    POC: Jim Karl, jkarl@us.ibm.com
  • National Semiconductor Corporation (Maine)
    The Trusted Solutions Business Unit offers trusted access to CMOS and mixed signal processes at the 0.65, 0.35, 0.25, and 0.18 micron technology nodes along with BiCMOS processes at 0.35 and 0.25 micron. National also offers CMOS process capabilities at the 0.25 and 0.18 micron nodes that are based on and compatible with TSMC processes and design rules.
    POC: Tony Bent, trusted.solutions@nsc.com
  • BAE Systems (Virginia)
    BAE Systems Information and Electronic Systems Integration, Inc. offers a complete design, fabrication, packaging, and test facility for VLSI wafer and module development and production. Wafer process technology offerings at the foundry include radiation hardened 0.5um, 0.25um, and 0.15um CMOS technologies.
    POC: Timothy R. Scott, timothy.scott@baesystems.com
  • Northrup Grumman (California)
    Northrup Grumman Space Technology offers foundry services that utilize advanced indium phosphide (InP) and gallium arsenide (GaAs) semiconductor manufacturing processes.
    POC: Al Lawrence, al.lawrence@ngc.com
  • Honeywell International (Minnesota)
    Honeywell International, Inc. Solid State Electronics Center offers a wide range of services including Rad Hard digital SOI CMOS, running at 150 nm, .35um, and .8um, and high temperature and mixed signal digital SOI CMOS at the .35um, and .8um level. Also included in services is multi-chip module package design.
    POC: David Wick david.g.wick@honeywell.com
  • HRL Labs (California)
    HRL Laboratories, LLC offers services for compound semiconductor devices and integrated circuits including InP HBT (both SHBT and DHBT), InP HEMT, and GaN HFET.
    POC: Charles Henry Fields, cfields@hrl.com
  • Intersil (Florida)
    Intersil Corporation offers a variety of technologies including CMOS, BiCMOS, and SOI in its accredited trusted foundry facility.
    POC: Michael Althar, maltha02@intersil.com